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Leaded wave soldering copper (Cu) impurities in the management of

文章出處： 發(fā)布時(shí)間： 2011年5月22日 人氣 5659

In the practical application of lead solder in the solder on copper (Cu) content of electronic technology and solder materials engineering profession have reached a consensus: tin-copper (Cu) content should be controlled about 0.15%, when the tin solder copper furnace (Cu) content of more than 0.15%, the incorporation of new material must be diluted copper content, while copper (Cu) content reached 0.3%, then the whole tin furnace solder to be replaced and the clear result of the furnace, re-join the new material. 400KG tin stove for a run, if the dilution process to take, more than 100KG need to add new material, or fail to reduce copper (Cu) results.